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Mechanical stress evolution and the Blech length: 2D simulation of early electromigration effects

dc.contributor.authorPetrescu, Violeta
dc.contributor.authorMouthaan, T.
dc.contributor.authorSchoenmaker, Wim
dc.contributor.authorSalm, C.
dc.date.accessioned2021-10-01T08:39:24Z
dc.date.available2021-10-01T08:39:24Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2852
dc.sourceIIOimport
dc.titleMechanical stress evolution and the Blech length: 2D simulation of early electromigration effects
dc.typeProceedings paper
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1047
dc.source.endpage1050
dc.source.conferenceProceedings of the 9th European Symposium on Reliability of Electron Devices and Failure Physics - ESREF
dc.source.conferencedate5/10/1998
dc.source.conferencelocationCopenhagen Denmark
imec.availabilityPublished - open access
imec.internalnotesSpecial issue Microelectronics Reliability; Vol. 38


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