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Influence of Si wafer thinning processes on (Sub)surface defects

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.authorUedono, Akira
dc.date.accessioned2021-10-24T06:06:12Z
dc.date.available2021-10-24T06:06:12Z
dc.date.issued2017
dc.identifier.issn0169-4332
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28563
dc.sourceIIOimport
dc.titleInfluence of Si wafer thinning processes on (Sub)surface defects
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage82
dc.source.endpage87
dc.source.journalApplied Surface Science
dc.source.volume404
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0169433217302829
imec.availabilityPublished - imec


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