Show simple item record

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorNolmans, Philip
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-24T07:00:15Z
dc.date.available2021-10-24T07:00:15Z
dc.date.issued2017
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28691
dc.sourceIIOimport
dc.titleImpact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
dc.typeJournal article
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.source.peerreviewyes
dc.source.beginpage297
dc.source.endpage305
dc.source.journalMicroelectronics Reliability
dc.source.volume79
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271417303013
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record