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Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly

dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T08:11:06Z
dc.date.available2021-10-24T08:11:06Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28848
dc.sourceIIOimport
dc.titleAlternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage8
dc.source.conference18th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and ... - IEEE EuroSime
dc.source.conferencedate3/04/2017
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7926236/
imec.availabilityPublished - open access


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