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The role of grain boundary structure on electromigration-induced drift in pure Al and Al(0.5wt% Cu)

dc.contributor.authorProost, Joris
dc.contributor.authorSamajdar, I.
dc.contributor.authorVerlinden, B.
dc.contributor.authorVan Houtte, P.
dc.contributor.authorMaex, Karen
dc.contributor.authorDelaey, L.
dc.date.accessioned2021-10-01T08:44:27Z
dc.date.available2021-10-01T08:44:27Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2886
dc.sourceIIOimport
dc.titleThe role of grain boundary structure on electromigration-induced drift in pure Al and Al(0.5wt% Cu)
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1039
dc.source.endpage1045
dc.source.journalScripta Materialia
dc.source.issue8
dc.source.volume39
imec.availabilityPublished - open access


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