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Cavity wafer bonding after deep silicon etch

dc.contributor.authorMalainou, Antonia
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-24T08:36:19Z
dc.date.available2021-10-24T08:36:19Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28900
dc.sourceIIOimport
dc.titleCavity wafer bonding after deep silicon etch
dc.typeMeeting abstract
dc.contributor.imecauthorMalainou, Antonia
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewyes
dc.source.conferenceThe International Conference on Wafer Bonding - Waferbond
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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