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Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

dc.contributor.authorMangal, Nivesh
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorSnyder, Brad
dc.date.accessioned2021-10-24T08:41:26Z
dc.date.available2021-10-24T08:41:26Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28909
dc.sourceIIOimport
dc.titlePackaging silicon photonics with polymer waveguides for 3D electro-optical integration
dc.typeProceedings paper
dc.contributor.imecauthorMangal, Nivesh
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage707
dc.source.endpage708
dc.source.conferenceIEEE Photonics Conference - IPC
dc.source.conferencedate1/10/2017
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8116289/
imec.availabilityPublished - open access


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