Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below
dc.contributor.author | Randall, John | |
dc.contributor.author | Tritchkov, Alexander | |
dc.contributor.author | Ronse, Kurt | |
dc.contributor.author | Jaenen, Patrick | |
dc.date.accessioned | 2021-10-01T08:46:11Z | |
dc.date.available | 2021-10-01T08:46:11Z | |
dc.date.issued | 1998 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2896 | |
dc.source | IIOimport | |
dc.title | Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below | |
dc.type | Journal article | |
dc.contributor.imecauthor | Ronse, Kurt | |
dc.contributor.imecauthor | Jaenen, Patrick | |
dc.contributor.orcidimec | Ronse, Kurt::0000-0003-0803-4267 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 83 | |
dc.source.endpage | 86 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.volume | 41/42 | |
imec.availability | Published - open access |