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ASIC chip, hybrid multisensor, and package co-design for smart gas monitoring module

dc.contributor.authorReczey, M.
dc.contributor.authorDobay, R.
dc.contributor.authorHarsanyi, G.
dc.contributor.authorIllyefalvi-Vitez, Z.
dc.contributor.authorVan Den Steen, Jean
dc.contributor.authorVervaet, A.
dc.contributor.authorReinert, W.
dc.contributor.authorUrbancik, J.
dc.contributor.authorGuljaev, A.
dc.contributor.authorVisy, C.
dc.contributor.authorBarsony, I.
dc.date.accessioned2021-10-01T08:46:45Z
dc.date.available2021-10-01T08:46:45Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2899
dc.sourceIIOimport
dc.titleASIC chip, hybrid multisensor, and package co-design for smart gas monitoring module
dc.typeProceedings paper
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage132
dc.source.endpage139
dc.source.conferenceProceedings of the IEEE Workshop on Chip/Package Co-Design
dc.source.conferencedate24/03/1998
dc.source.conferencelocationZürich Switzerland
imec.availabilityPublished - imec


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