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A system level approach to a structured MCM design methodology

dc.contributor.authorRingoot, Edwin
dc.contributor.authorTruzzi, Claudio
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-01T08:47:16Z
dc.date.available2021-10-01T08:47:16Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2902
dc.sourceIIOimport
dc.titleA system level approach to a structured MCM design methodology
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage184
dc.source.endpage189
dc.source.conferenceProceedings 1998 International Conference on Multichip Modules and High Density Packaging
dc.source.conferencedate15/04/1998
dc.source.conferencelocationDenver, CO USA
imec.availabilityPublished - open access


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