dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-24T10:29:10Z | |
dc.date.available | 2021-10-24T10:29:10Z | |
dc.date.issued | 2017-01 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29117 | |
dc.source | IIOimport | |
dc.title | Thermal aspects of 3D and 2.5D system integration | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.conference | SEMI European 3D Summit | |
dc.source.conferencedate | 23/01/2017 | |
dc.source.conferencelocation | Grenoble France | |
dc.identifier.url | http://www.semi.org/eu/european-3d-summit-2017-%E2%80%93-abstracts-and-biographies/#Herman | |
imec.availability | Published - imec | |