dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Webers, Tomas | |
dc.contributor.author | Salahouelhadj, Abdellah | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-24T10:29:47Z | |
dc.date.available | 2021-10-24T10:29:47Z | |
dc.date.issued | 2017-03 | |
dc.identifier.issn | 1043-7398 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29118 | |
dc.source | IIOimport | |
dc.title | Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding | |
dc.type | Journal article | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Webers, Tomas | |
dc.contributor.imecauthor | Salahouelhadj, Abdellah | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Salahouelhadj, Abdellah::0000-0002-3795-1446 | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.identifier.doi | 10.1115/1.4035597 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 11008 | |
dc.source.endpage | 011008-9 | |
dc.source.journal | Journal of Electronic Packaging | |
dc.source.issue | 1 | |
dc.source.volume | 139 | |
dc.identifier.url | http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2596186 | |
imec.availability | Published - imec | |