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Development of post InGaAs CMP cleaning process for sub 10nm device application

dc.contributor.authorPurushothaman, Muthukrishnan
dc.contributor.authorChoi, In-Chan
dc.contributor.authorKim, Hyun-Tae
dc.contributor.authorTeugels, Lieve
dc.contributor.authorKim, Tae-Gon
dc.contributor.authorPark, Jin-Goo
dc.date.accessioned2021-10-24T11:31:25Z
dc.date.available2021-10-24T11:31:25Z
dc.date.issued2017-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29230
dc.sourceIIOimport
dc.titleDevelopment of post InGaAs CMP cleaning process for sub 10nm device application
dc.typeProceedings paper
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate11/10/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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