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Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes

dc.contributor.authorSagi, K.V.
dc.contributor.authorTeugels, Lieve
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBabu, S.V.
dc.date.accessioned2021-10-24T12:39:58Z
dc.date.available2021-10-24T12:39:58Z
dc.date.issued2017
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29349
dc.sourceIIOimport
dc.titleChemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes
dc.typeJournal article
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.source.peerreviewyes
dc.source.beginpageP259
dc.source.endpageP264
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.issue5
dc.source.volume6
dc.identifier.urlhttp://jss.ecsdl.org/content/6/5/P259.abstract
imec.availabilityPublished - imec


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