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Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes

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1997 since deposited on 2021-10-24
1last month
Acq. date: 2026-01-07

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1997 since deposited on 2021-10-24
1last month
Acq. date: 2026-01-07

Citations