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Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes
Publication:
Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes
Date
2017
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sagi, K.V.
;
Teugels, Lieve
;
van der Veen, Marleen
;
Struyf, Herbert
;
Babu, S.V.
Journal
ECS Journal of Solid State Science and Technology
Abstract
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1996
since deposited on 2021-10-24
Acq. date: 2025-12-08
Citations
Metrics
Views
1996
since deposited on 2021-10-24
Acq. date: 2025-12-08
Citations