Publication:
Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes
Date
| dc.contributor.author | Sagi, K.V. | |
| dc.contributor.author | Teugels, Lieve | |
| dc.contributor.author | van der Veen, Marleen | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Babu, S.V. | |
| dc.contributor.imecauthor | Teugels, Lieve | |
| dc.contributor.imecauthor | van der Veen, Marleen | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
| dc.contributor.orcidimec | van der Veen, Marleen::0000-0002-9402-8922 | |
| dc.date.accessioned | 2021-10-24T12:39:58Z | |
| dc.date.available | 2021-10-24T12:39:58Z | |
| dc.date.issued | 2017 | |
| dc.identifier.issn | 2162-8769 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29349 | |
| dc.identifier.url | http://jss.ecsdl.org/content/6/5/P259.abstract | |
| dc.source.beginpage | P259 | |
| dc.source.endpage | P264 | |
| dc.source.issue | 5 | |
| dc.source.journal | ECS Journal of Solid State Science and Technology | |
| dc.source.volume | 6 | |
| dc.title | Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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