Show simple item record

Tape-assisted fusion bonding for wafers with through Si holes

dc.contributor.authorStassen, Andim
dc.contributor.authorVisker, Jakob
dc.contributor.authorAndrei, Alexandru
dc.contributor.authorFondu, Jelle
dc.date.accessioned2021-10-24T14:10:09Z
dc.date.available2021-10-24T14:10:09Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29497
dc.sourceIIOimport
dc.titleTape-assisted fusion bonding for wafers with through Si holes
dc.typeMeeting abstract
dc.contributor.imecauthorStassen, Andim
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorAndrei, Alexandru
dc.contributor.imecauthorFondu, Jelle
dc.contributor.orcidimecStassen, Andim::0000-0001-8819-9592
dc.source.peerreviewyes
dc.source.conferenceThe International Conference on Wafer Bonding - WAFERBOND
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record