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Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints

dc.contributor.authorTang, Ya-Sheng
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorKho, Yi-Tung
dc.contributor.authorChang, Yao-Jen
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorDe Preter, Inge
dc.contributor.authorVanstreels, Kris
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.contributor.authorChen, Kuan-Neng
dc.date.accessioned2021-10-24T14:45:25Z
dc.date.available2021-10-24T14:45:25Z
dc.date.issued2017
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29552
dc.sourceIIOimport
dc.titleInvestigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints
dc.typeJournal article
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1899
dc.source.endpage1905
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue11
dc.source.volume7
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8024028/
imec.availabilityPublished - open access


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