Authors

Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng

ISSN

2156-3950

Issue

11

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

7

Title

Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints

Publication type

Journal article

Embargo date

9999-12-31