Publication:

Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints

Date

2017

Journal article

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Files

36067.pdf 2.22 MB

Author(s)

;

Derakhshandeh, Jaber

;

;

;

Slabbekoorn, John

;

De Preter, Inge

;

Vanstreels, Kris

;

Rebibis, Kenneth June

;

;

Chen, Kuan-Neng

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Statistics

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Acq. date: 2026-02-24