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Damage evolution and mechanical failure in flip-chip interconnects

dc.contributor.authorSoper, A.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorPozza, G.
dc.contributor.authorIgnat, M.
dc.contributor.authorParat, G.
dc.date.accessioned2021-10-01T08:59:37Z
dc.date.available2021-10-01T08:59:37Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2966
dc.sourceIIOimport
dc.titleDamage evolution and mechanical failure in flip-chip interconnects
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage105
dc.source.endpage110
dc.source.conferenceElectronic Packaging and Materials Science X
dc.source.conferencedate14/04/1998
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 515


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