dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Vanhee, Filip | |
dc.contributor.author | Pissoort, Davy | |
dc.contributor.author | Degrendele, Lieven | |
dc.contributor.author | De Baets, Johan | |
dc.contributor.author | Allaert, Bart | |
dc.contributor.author | Lauwaert, Ralph | |
dc.contributor.author | Zanon, Franco | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Willems, Geert | |
dc.date.accessioned | 2021-10-24T17:00:25Z | |
dc.date.available | 2021-10-24T17:00:25Z | |
dc.date.issued | 2017 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29764 | |
dc.source | IIOimport | |
dc.title | Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Degrendele, Lieven | |
dc.contributor.imecauthor | De Baets, Johan | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Willems, Geert | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Willems, Geert::0000-0002-9137-618X | |
dc.source.peerreview | yes | |
dc.source.beginpage | 131 | |
dc.source.endpage | 135 | |
dc.source.journal | Microelectronics Reliability | |
dc.source.volume | 74 | |
dc.identifier.url | http://www.sciencedirect.com/science/article/pii/S0026271417300987 | |
imec.availability | Published - imec | |