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Effect of deposition methods on material removal rate during nickel CMP

dc.contributor.authorWang, Yanni
dc.contributor.authorTeugels, Lieve
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-24T18:38:54Z
dc.date.available2021-10-24T18:38:54Z
dc.date.issued2017-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29909
dc.sourceIIOimport
dc.titleEffect of deposition methods on material removal rate during nickel CMP
dc.typeMeeting abstract
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate11/10/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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