Show simple item record

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-24T18:46:35Z
dc.date.available2021-10-24T18:46:35Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29919
dc.sourceIIOimport
dc.titleHigh efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
dc.typeProceedings paper
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage733
dc.source.endpage736
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate2/12/2017
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record