Browsing Book chapters by imec author "409d33832e4264f8f1a713c9d36a6b1d48b72b3a"
Now showing items 1-5 of 5
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Low-power ADCs for biomedical applications
Craninckx, Jan; Van der Plas, Geert (2011) -
Modeling and Characterization of TSV-Induced Noise Coupling
Sun, Xiao; Rack, Martin; Van der Plas, Geert; Raskin, Jean-Pierre; Beyne, Eric (2018) -
Substrate noise coupling from digital to analog circuits in mixed-signal integrated circuits
Wambacq, Piet; Soens, Charlotte; Van der Plas, Geert; Badaroglu, Mustafa; Donnay, Stephane (2007) -
Thermal modeling and experimental model validation for 3D stacked ICs
Oprins, Herman; Maggioni, Federica; Cherman, Vladimir; Van der Plas, Geert; Beyne, Eric (2019-04) -
Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
Milojevic, Dragomir; Agrawal, Prashant; Raghavan, Praveen; Van der Plas, Geert; Catthoor, Francky; Van der Perre, Liesbet; Velenis, Dimitrios; Varadarajan, Ravi; Beyne, Eric (2019)