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Book chapters
Thermal modeling and experimental model validation for 3D stacked ICs
Publication:
Thermal modeling and experimental model validation for 3D stacked ICs
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Date
2019-04
Book Chapter
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Maggioni, Federica
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Beyne, Eric
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Abstract
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Acq. date: 2025-12-12
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Views
2097
since deposited on 2021-10-27
2
last month
1
last week
Acq. date: 2025-12-12
Citations