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Thermal modeling and experimental model validation for 3D stacked ICs
Publication:
Thermal modeling and experimental model validation for 3D stacked ICs
Date
2019-04
Book Chapter
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Maggioni, Federica
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Beyne, Eric
Journal
Abstract
Description
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2094
since deposited on 2021-10-27
Acq. date: 2025-10-25
Citations
Metrics
Views
2094
since deposited on 2021-10-27
Acq. date: 2025-10-25
Citations