Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Book chapters
Modeling and Characterization of TSV-Induced Noise Coupling
Publication:
Modeling and Characterization of TSV-Induced Noise Coupling
Copy permalink
Date
2018
Book Chapter
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Rack, Martin
;
Van der Plas, Geert
;
Raskin, Jean-Pierre
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1932
since deposited on 2021-10-26
1
last month
Acq. date: 2025-12-12
Citations
Metrics
Views
1932
since deposited on 2021-10-26
1
last month
Acq. date: 2025-12-12
Citations