A study on substrate noise coupling among TSVs in 3D chip stack

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Authors

Araga, Yuuki; Nagata, Makoto; De Vos, Joeri; Van der Plas, Geert; Beyne, Eric

ISSN

1349-2543

Issue

13

Journal

IEICE Electronics Express

Volume

15

Title

A study on substrate noise coupling among TSVs in 3D chip stack

Publication type

Journal article

Embargo date

9999-12-31

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