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High heat flux dissipation via interposer active micro-cooling

dc.contributor.authorBuja, Federico
dc.contributor.authorZhang, Lei
dc.contributor.authorCherman, Vladimir
dc.contributor.authorOprins, Herman
dc.contributor.authorJones, Ben
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-25T16:57:56Z
dc.date.available2021-10-25T16:57:56Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30334
dc.sourceIIOimport
dc.titleHigh heat flux dissipation via interposer active micro-cooling
dc.typeProceedings paper
dc.contributor.imecauthorZhang, Lei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorJones, Ben
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage287
dc.source.endpage288
dc.source.conference50th Solid State Devices and Materials Conference - SSDM
dc.source.conferencedate9/09/2018
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


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