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Opportunities and challenges of resistive RAM for neuromorphic applications

dc.contributor.authorDegraeve, Robin
dc.contributor.authorMallik, Arindam
dc.contributor.authorGarbin, Daniele
dc.contributor.authorDoevenspeck, Jonas
dc.contributor.authorFantini, Andrea
dc.contributor.authorRodopoulos, Dimitrios
dc.contributor.authorRoussel, Philippe
dc.contributor.authorGovoreanu, Bogdan
dc.contributor.authorHendrickx, Paul
dc.contributor.authorDi Piazza, Luca
dc.contributor.authorStuijt, Jan
dc.contributor.authorSchaafsma, Siebren
dc.contributor.authorDebacker, Peter
dc.contributor.authorDonadio, Gabriele Luca
dc.contributor.authorHody, Hubert
dc.contributor.authorGoux, Ludovic
dc.contributor.authorKar, Gouri Sankar
dc.contributor.authorFurnemont, Arnaud
dc.contributor.authorMocuta, Anda
dc.contributor.authorVerkest, Diederik
dc.date.accessioned2021-10-25T17:57:27Z
dc.date.available2021-10-25T17:57:27Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30579
dc.sourceIIOimport
dc.titleOpportunities and challenges of resistive RAM for neuromorphic applications
dc.typeProceedings paper
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorGarbin, Daniele
dc.contributor.imecauthorDoevenspeck, Jonas
dc.contributor.imecauthorFantini, Andrea
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorGovoreanu, Bogdan
dc.contributor.imecauthorHendrickx, Paul
dc.contributor.imecauthorDi Piazza, Luca
dc.contributor.imecauthorStuijt, Jan
dc.contributor.imecauthorSchaafsma, Siebren
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorDonadio, Gabriele Luca
dc.contributor.imecauthorHody, Hubert
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.imecauthorFurnemont, Arnaud
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecGarbin, Daniele::0000-0002-5884-1043
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecStuijt, Jan::0000-0001-6797-2339
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecFurnemont, Arnaud::0000-0002-6378-1030
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conferenceIEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate16/07/2018
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8452548
imec.availabilityPublished - open access


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