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Silicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process

dc.contributor.authorFiorentino, Giuseppe
dc.contributor.authorJones, Ben
dc.contributor.authorRoth, Sophie
dc.contributor.authorGrac, Edith
dc.contributor.authorJayapala, Murali
dc.contributor.authorBex, Pieter
dc.contributor.authorDuarte de Almeida, Daniel
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorSeveri, Simone
dc.date.accessioned2021-10-25T18:38:58Z
dc.date.available2021-10-25T18:38:58Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30707
dc.sourceIIOimport
dc.titleSilicon-quartz microcapillary opto-fluidic platform obtained by CMOS-compatible Die to Wafer 200 mm dual bonding process
dc.typeProceedings paper
dc.contributor.imecauthorFiorentino, Giuseppe
dc.contributor.imecauthorJones, Ben
dc.contributor.imecauthorRoth, Sophie
dc.contributor.imecauthorJayapala, Murali
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorSeveri, Simone
dc.contributor.orcidimecJayapala, Murali::0000-0001-7917-0149
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1018
dc.source.conferenceEurosensors 2018
dc.source.conferencedate9/09/2018
dc.source.conferencelocationGraz Austria
dc.identifier.urlhttps://doi.org/10.3390/proceedings2131018
imec.availabilityPublished - open access
imec.internalnotesMDPI Proceedings; Vol. 2(2018)


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