dc.contributor.author | Flack, Warren | |
dc.contributor.author | Hsieh, Robert | |
dc.contributor.author | Nguyen, Ha-Ai | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Suhard, Samuel | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Hiro, Akito | |
dc.contributor.author | Hidremont, Romain | |
dc.date.accessioned | 2021-10-25T18:39:40Z | |
dc.date.available | 2021-10-25T18:39:40Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/30709 | |
dc.source | IIOimport | |
dc.title | One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Suhard, Samuel | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Hiro, Akito | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 395 | |
dc.source.endpage | 400 | |
dc.source.conference | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) | |
dc.source.conferencedate | 4/12/2018 | |
dc.source.conferencelocation | Singapore Singapore | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8654363 | |
imec.availability | Published - open access | |