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BTI reliability improvement strategies in low thermal budget gate dtacks for 3D sequential integration

dc.contributor.authorFranco, Jacopo
dc.contributor.authorWu, Zhicheng
dc.contributor.authorRzepa, Gerhard
dc.contributor.authorVandooren, Anne
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorHellings, Geert
dc.contributor.authorBrus, Stephan
dc.contributor.authorCott, Daire
dc.contributor.authorDe Heyn, Vincent
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorRyckaert, Julien
dc.contributor.authorCollaert, Nadine
dc.contributor.authorLinten, Dimitri
dc.contributor.authorGrasser, Tibor
dc.contributor.authorKaczer, Ben
dc.date.accessioned2021-10-25T18:45:40Z
dc.date.available2021-10-25T18:45:40Z
dc.date.issued2018-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30725
dc.sourceIIOimport
dc.titleBTI reliability improvement strategies in low thermal budget gate dtacks for 3D sequential integration
dc.typeProceedings paper
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorWu, Zhicheng
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorKaczer, Ben
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecGroeseneken, Guido::0000-0003-3763-2098
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.source.peerreviewyes
dc.source.beginpage787
dc.source.endpage790
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate1/12/2018
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8614559
imec.availabilityPublished - imec


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