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Bump pad design and its impact on the reliability of flip chip packages

dc.contributor.authorGonzalez, Mario
dc.contributor.authorLofrano, Melina
dc.contributor.authorVanstreels, Kris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T19:07:59Z
dc.date.available2021-10-25T19:07:59Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30785
dc.sourceIIOimport
dc.titleBump pad design and its impact on the reliability of flip chip packages
dc.typeMeeting abstract
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage125
dc.source.conference10th European Conference on Residual Stresses - ECRS10
dc.source.conferencedate11/09/2018
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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