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dc.contributor.authorGroven, Benjamin
dc.contributor.authorTomczak, Yoann
dc.contributor.authorNalin Mehta, Ankit
dc.contributor.authorBender, Hugo
dc.contributor.authorZhang, Haodong
dc.contributor.authorSchram, Tom
dc.contributor.authorSmets, Quentin
dc.contributor.authorHeyns, Marc
dc.contributor.authorCaymax, Matty
dc.contributor.authorRadu, Iuliana
dc.contributor.authorDelabie, Annelies
dc.date.accessioned2021-10-25T19:18:06Z
dc.date.available2021-10-25T19:18:06Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30811
dc.sourceIIOimport
dc.titleAssessing the prospects of atomic layer deposition for two-dimensional materials in microelectronic applications
dc.typeMeeting abstract
dc.contributor.imecauthorGroven, Benjamin
dc.contributor.imecauthorTomczak, Yoann
dc.contributor.imecauthorNalin Mehta, Ankit
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorSmets, Quentin
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorCaymax, Matty
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.imecauthorDelabie, Annelies
dc.contributor.orcidimecGroven, Benjamin::0000-0002-5781-7594
dc.contributor.orcidimecNalin Mehta, Ankit::0000-0002-2169-940X
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecSmets, Quentin::0000-0002-2356-5915
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.source.peerreviewyes
dc.source.conferenceMaterial Science and Engineering Congress - MSE
dc.source.conferencedate26/09/2018
dc.source.conferencelocationDarmstadt Germany
imec.availabilityPublished - imec


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