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Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch

dc.contributor.authorGupta, Anshul
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorSaad, Yves
dc.contributor.authorCiofi, Ivan
dc.contributor.authorWilson, Chris
dc.date.accessioned2021-10-25T19:22:18Z
dc.date.available2021-10-25T19:22:18Z
dc.date.issued2018
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30822
dc.sourceIIOimport
dc.titleIntegration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch
dc.typeJournal article
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorWilson, Chris
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.source.peerreviewyes
dc.source.beginpage20
dc.source.endpage24
dc.source.journalMicroelectronic Engineering
dc.source.volume191
dc.identifier.urlhttps://doi.org/10.1016/j.mee.2018.01.013
imec.availabilityPublished - imec
imec.internalnotesMAM Conference, March 2017, Dresden


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