Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch

Thumbnail
Metadata
Show full item record
Authors
Gupta, Anshul; Boemmels, Juergen; Saad, Yves; Ciofi, Ivan; Wilson, Chris
ISSN
0167-9317
Journal
Microelectronic Engineering
Volume
191
Title
Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch
Publication type
Journal article
Collections