Publication:
Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch
Date
| dc.contributor.author | Gupta, Anshul | |
| dc.contributor.author | Boemmels, Juergen | |
| dc.contributor.author | Saad, Yves | |
| dc.contributor.author | Ciofi, Ivan | |
| dc.contributor.author | Wilson, Chris | |
| dc.contributor.imecauthor | Gupta, Anshul | |
| dc.contributor.imecauthor | Boemmels, Juergen | |
| dc.contributor.imecauthor | Ciofi, Ivan | |
| dc.contributor.imecauthor | Wilson, Chris | |
| dc.contributor.orcidimec | Ciofi, Ivan::0000-0003-1374-4116 | |
| dc.date.accessioned | 2021-10-25T19:22:18Z | |
| dc.date.available | 2021-10-25T19:22:18Z | |
| dc.date.issued | 2018 | |
| dc.identifier.issn | 0167-9317 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/30822 | |
| dc.identifier.url | https://doi.org/10.1016/j.mee.2018.01.013 | |
| dc.source.beginpage | 20 | |
| dc.source.endpage | 24 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 191 | |
| dc.title | Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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