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Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch
Publication:
Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch
Date
2018
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gupta, Anshul
;
Boemmels, Juergen
;
Saad, Yves
;
Ciofi, Ivan
;
Wilson, Chris
Journal
Microelectronic Engineering
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2042
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations
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Views
2042
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations