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CuNi alloy electrodeposition for microbumps using benzotriazole

dc.contributor.authorHaesevoets, Karel
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-25T19:26:55Z
dc.date.available2021-10-25T19:26:55Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30834
dc.sourceIIOimport
dc.titleCuNi alloy electrodeposition for microbumps using benzotriazole
dc.typeMeeting abstract
dc.contributor.imecauthorHaesevoets, Karel
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage1264
dc.source.conference223rd ECS Meeting Symposium E02: Surfactant and Additive Effects on Thin Film Deposition, Dissolution, and Particle Growth
dc.source.conferencedate13/05/2018
dc.source.conferencelocationSeattle, WA USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2018-01/19/1264.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2018-01


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