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Vertical-cavity silicon-integrated lasers by bonding and transfer printing

dc.contributor.authorHaglund, E.P.
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorGustavsson, J.S.
dc.contributor.authorBaets, Roel
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorLarsson, A.
dc.date.accessioned2021-10-25T19:27:19Z
dc.date.available2021-10-25T19:27:19Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30835
dc.sourceIIOimport
dc.titleVertical-cavity silicon-integrated lasers by bonding and transfer printing
dc.typeProceedings paper
dc.contributor.imecauthorKumari, Sulakshna
dc.contributor.imecauthorGoyvaerts, Jeroen
dc.contributor.imecauthorBaets, Roel
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage241
dc.source.endpage242
dc.source.conference26th International Semiconductor Laser Conference - ISLC
dc.source.conferencedate16/09/2018
dc.source.conferencelocationSanta Fe, NM USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8516256
imec.availabilityPublished - open access
imec.internalnotesISBN 978-1-5386-6485-8


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