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EUV lithography qualification: Comparison of alternative wafer inspection methodologies and sensitivities

dc.contributor.authorHalder, Sandip
dc.contributor.authorLeray, Philippe
dc.date.accessioned2021-10-25T19:28:45Z
dc.date.available2021-10-25T19:28:45Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30839
dc.sourceIIOimport
dc.titleEUV lithography qualification: Comparison of alternative wafer inspection methodologies and sensitivities
dc.typeOral presentation
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorLeray, Philippe
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.source.peerreviewno
dc.source.conferenceSPIE Metrology, Inspection, and Process Control for Microlithography XXXII Conference
dc.source.conferencedate25/02/2018
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://www.spie.org/AL18/conferencedetails/metrology-inspection-process-control-microlithography?SSO=1
imec.availabilityPublished - imec
imec.internalnotes10585-72


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