Show simple item record

Thermal cycling reliability analysis for redistributed flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-01T09:30:17Z
dc.date.available2021-10-01T09:30:17Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3092
dc.sourceIIOimport
dc.titleThermal cycling reliability analysis for redistributed flip chip assemblies
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceIEEE Workshop on VLSI and Microsystems Packaging Techniques and Manufacturing Technologies
dc.source.conferencedate4/05/1998
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
2876.pdf
Size:
356.4Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record