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Edge trimming induced defects on direct bonded wafers

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorKosemura, Daisuke
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T20:10:12Z
dc.date.available2021-10-25T20:10:12Z
dc.date.issued2018
dc.identifier.issn1043-7398
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30938
dc.sourceIIOimport
dc.titleEdge trimming induced defects on direct bonded wafers
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage31004
dc.source.journalJournal of Electronic Packaging
dc.source.issue3
dc.source.volume140
dc.identifier.urlhttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleid=2679409
imec.availabilityPublished - imec


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