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Thermo-mechanical analysis for optimising the underfill material properties of flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-01T09:30:31Z
dc.date.available2021-10-01T09:30:31Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3093
dc.sourceIIOimport
dc.titleThermo-mechanical analysis for optimising the underfill material properties of flip chip assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage110
dc.source.endpage113
dc.source.conferenceProceedings of the SEM spring conference on experimental and applied mechanics and experimental/numerical mechanics in electroni
dc.source.conferencedate1/06/1998
dc.source.conferencelocationHouston, TX USA
imec.availabilityPublished - open access


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