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Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorStucchi, Michele
dc.contributor.authorAfanasiev, Valeri
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T20:13:34Z
dc.date.available2021-10-25T20:13:34Z
dc.date.issued2018
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30946
dc.sourceIIOimport
dc.titleDefect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy
dc.typeJournal article
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorAfanasiev, Valeri
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage71904
dc.source.journalApplied Physics Letters
dc.source.issue7
dc.source.volume112
dc.identifier.urlhttps://aip.scitation.org/doi/full/10.1063/1.5012892
imec.availabilityPublished - imec


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