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Thermal fatigue reliability analysis of redistributed flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-01T09:30:46Z
dc.date.available2021-10-01T09:30:46Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3094
dc.sourceIIOimport
dc.titleThermal fatigue reliability analysis of redistributed flip chip assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage37
dc.source.endpage44
dc.source.conference48th IEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/1998
dc.source.conferencelocationSeattle, WA USA
imec.availabilityPublished - open access


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