Thermo-mechanical reliability optimisation of small sized SMD components
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Roggen, Jean | |
dc.contributor.author | Caers, J. | |
dc.contributor.author | Van Veen, C. | |
dc.date.accessioned | 2021-10-01T09:31:03Z | |
dc.date.available | 2021-10-01T09:31:03Z | |
dc.date.issued | 1998 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/3095 | |
dc.source | IIOimport | |
dc.title | Thermo-mechanical reliability optimisation of small sized SMD components | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 100 | |
dc.source.endpage | 102 | |
dc.source.conference | 3rd European Conf. on Electronic Packaging Technology and 9th Int. Conf. on Interconnection Technology in Electronics | |
dc.source.conferencedate | 15/06/1998 | |
dc.source.conferencelocation | Nuremberg Germany | |
imec.availability | Published - open access | |
imec.internalnotes | DVS-Berichte; Vol. 191 |